The full automatic system for inner-, outer-layer, solder- and special-mask production. The machine can handle rigid, flex, flex-rigid, hdi, high-frequency and other special pcb materials.
The full automatic system for inner-, outer-layer, solder- and special-mask production. The machine can handle substrate materials for the big player in the world.
The full automatic system for chemical-milling, photo-forming and special mask production.
The machine can handle rigid and flex materials.
Expose wet coated glass.
In the maskless Application without any touch to the surface.
For Panels with more than 10kg we have the inline solution without any special Loading System.
Extra large Backpanel 1300x600mm
* For details about patent, please contact the Headquarters.
** Print the serialization id for traceability of your products, every machine status can upload to the managing tool.
*** For additional information please contact your distributor.